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99.95% High purity SiAl sputtering Target
1.Detail:| Content | Si: 90 wt% ,Al:10 wt% |
| Purity | ≥99.95% |
| Relative Density | ≥96% |
| Resistivity | ≤10mΩ·cm |
| Specification | length(max)4000mm*thickness(max)13mm; linearity:05.mm |
| Processing Mode | Plasma spraying |
| Application | Low emission glass |
| Delivery time | 2 Weeks after receipt of deposit |
2.Why Us :
| High purity | 99.9% |
| Uniform composition | element Deviation Index ±2wt% |
| Smaller grain | <100μm |
| High density | 2.251g/cm |
| Low resitivity | 7 mΩ·cm |
3: Production Workflow Chart
4:Packing :
According to customers' request.
5:Impurity Content:
Fe<=0.03% Cd<=0.0005% Pb<=0.0005% As<=0.0002%
Mn<=0.001% Cu<=0.0005% K<=0.001% Ca<=0.001%
6.Independent intelligent property right
6.Independent intelligent property right
We have obtained 11 independent intelligrnt property rights about sputtering targets and plasma spraying equipments .
